Suche

spectrum of adhesion and bonding properties. PUR prepolymers are established problem-solvers that facilitate the reliable bonding of different materials and [...] odourless after complete curing - good resistance to water and temperature - high bond strengths

more quickly when bonding veneers.” This process stage has a special history at ALBO, as certain types of veneer were initially difficult to bond. Together with [...] with Jowat, the bonding process was examined in detail so that all shortcomings could be successfully remedied. Even the bonding of metal and leather as a special [...] department is already working hard with his colleagues on converting ALBO’s bonding processes further still. Faster to the finish The door manufacturer also benefits

moistureresistant bonds that also need to be able to withstand mechanical loads for a long time. A certain amount of flexibility in the bond reduces the risk [...] adhesive’s adhesion properties. The most common type of adhesive used for bonding construction textiles is strong PO hot melts. While the adhesive is applied [...] processors choose a PO or a PUR adhesive, Jowat supplies suitable and reliable bonding solutions that will put a safe roof over your head in both scenarios. Read

vehicle drive rather than the dashboard electronics. The manufacturing and bonding requirements for the compartment cover of these batteries is demanding, David [...] performed by renowned automobile manufacturers confirm the high resistance of the bonded part to temperatures and humidity. Extreme temperatures from -30°C to 85°C [...] well as long-term alternating climate tests. For many years, the demand for bonding solutions has been growing as quickly as the interest in electric vehicles

production step requires not just the utmost care, but also an outstanding bonding solution that guarantees both fine application and reliable adhesion, right [...] quantities and outstanding results both for active carbon binding and when bonding multi-layered filter media. The combined use of this versatile adhesive can [...] 100–120°C, which not only saves energy but also improves safety during the bonding process. This adhesive has a lot to offer—especially when you consider how

they have to be bonded. And here – at least in most cases – the adhesives used are made from fossil raw materials. Even if adhesive bonding only accounts for [...] Adhesives is certain: “If one global player pays attention to sustainable bonding, others – including smaller companies – will soon follow suit.” This is exactly

require precise bonding. One of the last steps in the wrapping process, is to fold the paper like an envelope. The adhesive used for bonding must be able to [...] the high strength of the kraft liner can also be a challenge when it comes bonding and automated processing. During automated packaging, completed within fractions [...] explains. Hedlunda can therefore remain confident that the packaging remains bonded together when potentially shipped to warmer climates. Jowat impresses with

for more intuitive use. This will lead to new materials—and, in turn, new bonding solutions, which Jowat is working with manufacturers to develop. One example [...] its models,” says Florian Krüger. “One of the factors that is important when bonding these is the purity of the recycled material.” The use of renewable raw materials [...] make car design more sustainable in every way, an environmentally friendly bonding solution will also be required. In the Jowatherm-Reaktant® MR 642.90, the

the bags. A bonding solution is needed which meets the requirements mentioned above and which is compatible with the machines. Reliable bonding Jowat-Toptherm [...] starting from 99°C and the clean adhesive string cut-off at the nozzle. Strong bonds and the low processing temperature of the adhesive coupled with a string-free

to be fixed to the sawing device. Both processes are usually carried out by bonding with a two-component epoxy resin adhesive applied by specially developed robots [...] voltage is applied, enables adhesive weakening and simplified dissolution of the bond. Since an important step in the further development of wafer production is the