temperatures from -50 °C to +80 °C. Application: For bonding many materials used in the wood-processing industry, in the electrical, electronics, rubber, and [...] for bonding glass. Flat lamination Jowat ® UF Resin Characteristics: Urea formaldehyde resin (UF resin) in powder form with integrated hardener. Minimised ble [...] substrates in warm and hot presses, as well as for solid wood bonding. Frequently used in HF presses in the manufacturing of multilayer formed parts.
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