temperatures from -50 °C to +80 °C. Application: For bonding many materials used in the wood-processing industry, in the electrical, electronics, rubber, and [...] Not suitable for bonding glass. Jowat ® 脲醛树脂胶(粉末状) Characteristics: Urea formaldehyde resin (UF resin) in powder form with integrated hardener. Minimised ble [...] substrates in warm and hot presses, as well as for solid wood bonding. Frequently used in HF presses in the manufacturing of multilayer formed parts. Jowat
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